Information for Authors

Join colleagues and friends from around to world to consider current issues in emissions and susceptibility in analog, digital and mixed-signal integrated circuits. Explore recent advances in simulation and measurement techniques, models, standards, tools and design methodologies. EMC Compo 2017 invites original, unpublished contributions covering EMC of integrated circuits and systems.

EMC Compo 2017 - Call for Papers

Scope and Topics

  • Measurement and modelling of IC emissions and susceptibility
  • Signal Integrity and Power Integrity at IC and PCB level
  • EMC-aware IC Design and Guidelines
  • Tools to handle EMC at IC level
  • Computational Electromagnetics for IC level EMC
  • EMC issues in System-on-chip (SoC), System-in-Package (SiP), and 3D ICs
  • EMC issues in smart power ICs
  • EMC of ICs in wireless communications
  • EMC of ICs for biomedical applications
  • Materials for improved EMC of ICs
  • Harsh environment effects on IC level EMC
  • Long term electromagnetic robustness of ICs
  • Standards and regulations up to 6 GHz
  • Modern EMC education on IC level EMC
  • Influence of IC EMC on system design
  • Intentional Electromagnetic Interference

Paper Submission

Initial Submission Process

Submission Criteria

Submission of Final Manuscripts

Conditions of Paper Acceptance

  • Attendee registration (with the registration fee paid) of at least one of the authors is required by the final paper submission date of 23th May, 2017
    • Papers without at least one accompanying attendee registration (author or student, as applicable) will not be processed
    • One (co-)author is allowed to register for multiple papers
  • All accepted (final) papers will be submitted for publication in the IEEE Xplore® database, one of the most comprehensive interdisciplinary engineering databases in the world
  • The final submitted PDF file must comply with the IEEE rules
  • For every paper, an IEEE Electronic Copyright Transfer Form must be completed
  • We reserve the right to exclude a paper from distribution after the conference (e.g. exclusion from IEEE Xplore®) if the paper is not presented either orally or as a poster at the conference.

Final Manuscript Submission Instructions

  • Prepare a PDF of the final version of your accepted paper which must conform to the following:
    • A maximum length of 6 pages
    • Follow the two-column A4 format of the A4 IEEE Manuscript Template for Conference Proceedings
    • All fonts used should be embedded in the PDF
  • The IEEE Electronic Copyright Transfer Form must be completed prior to submission of the final paper
    • Details will be communicated to paper authors by email
    • Please contact us if you have any questions or problems
      (email: irvc.eltech@mail.ru).

Poster Presentations

  • Papers selected for poster presentation will be included in the proceedings and IEEE explore in the same way as papers selected for oral presentation.
  • Authors selected for poster presentation should bring a printed copy of their poster to the conference.
  • A poster board 1,8 m high by 0,7 m wide will be available for each poster:
    • the boards should accept A1 size in portrait format (594 mm ×841 mm)
    • Please use fonts that are visible from 2m (28pt if possible)
  • No template is provided you are invited to customise your poster in your company or organisation's livery.
  • Please contact us if you have any questions or problems
    (email: irvc.eltech@mail.ru)

Important Dates

Milestone Date
Abstract Submission Deadline 30.12.2016 23.01.2017
Notification of Acceptance 06.02.2017 06.03.2017
Submission of Final Paper 23.05.2017
Upload Presentation 28.06.2017
Workshop 04.07.2017 - 08.07.2017